Development of rigid polishing materials for use in microelectronics
https://doi.org/10.35164/0554-2901-2024-02-39-44
Abstract
The paper presents the results of development of conditions for obtaining hard polishing materials based on polyetherurethane solutions for chemical-mechanical planarization of semiconductor silicon wafers.
About the Authors
D. I. Terashkevich
A.N. Kosygin Russian State University (Technology. Design. Art)
Russian Federation
Russian Federation
Moscow
E. S. Bokova
A.N. Kosygin Russian State University (Technology. Design. Art)
Russian Federation
Russian Federation
Moscow
N. V. Evsukova
A.N. Kosygin Russian State University (Technology. Design. Art)
Russian Federation
Russian Federation
Moscow
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Review
For citations:
Terashkevich D.I., Bokova E.S., Evsukova N.V. Development of rigid polishing materials for use in microelectronics. Plasticheskie massy. 2024;(2):39-44. (In Russ.) https://doi.org/10.35164/0554-2901-2024-02-39-44
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